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Semiconductor dicing systems with water jet guided laser ...

Synova's new 300 mm (12") wafer dicing system integrates a maintenance free fiber laser. Details page LDGS 300 A The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers.

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The Walter Heliset Uno - for presetting tools and grinding wheels up to 230mm diameter and 370mm long – uses Laser-Edge Finder technology for fast positioning/viewing, powerful image processing ...

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XL Laser Cutting System - synova-usa

milling, slicing, edge grinding, engraving, profiling The XLS Laser Cutting System integrates Synova's state-of-the-art Laser MicroJet ® (LMJ) technology with a wide machine platform and table for large work pieces. The 5-axis XLS 1005 with optional C2 rotary axis allows high-

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Founded in 2002 with a total investment of more than 15 million US Dollars, Suzhou Stonemate Machinery Co., Ltd. is committed to focusing on the diamond tool and stone machinery industry and supplying the best products and services to our dear customers. Covering an area of 23,000 square meters, our company is composed of a Machinery Department ...

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Machine for laminated and insulating glass production ...

Vertical edge seaming and grinding machine with LiTEC slider technology. EPS . Vertical fully-automatic grinding and polishing machine with fast double heads. KBU . Vertical glass edge processing center. Edge Seaming . ... Laser systems – Innovation, durability, efficient work and low operating costs. Laser systems .

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Wafer grinding machine - Silicon Technology Corporation . 1997/10/21 · The wafer grinding machine uses a centrally located robot to move a wafer from an input station to a measuring station. Thereafter, the wafer is moved into a grind station and a wash station sequentia ...

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Diamond Cutting Systems - Synova SA

First Laser Stencil (LSS) and Edge Grinding Systems (LGS) Relocation of international headquarters to Ecublens-Lausanne, Switzerland. 2001 : Introduction of Laser Dicing Systems (LDS) for electronics and semiconductor industry and Laser Cutting Systems (LCS) 1997 : Foundation of Synova S.A. Numerous awards for LMJ breakthrough invention. 1993

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Company - Synova SA

First Laser Stencil (LSS) and Edge Grinding Systems (LGS) Relocation of international headquarters to Ecublens-Lausanne, Switzerland. 2001 : Introduction of Laser Dicing Systems (LDS) for electronics and semiconductor industry and Laser Cutting Systems (LCS) 1997 : Foundation of Synova S.A. Numerous awards for LMJ breakthrough invention. …

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Cool Laser Machining - Synova

Innovative Laser Machining Systems Synova is the pioneer of a revolutionary water jet guided laser technology providing state-of-the-art cutting and dicing solutions as well as drilling and edge grinding systems for the energy, aerospace, tool, diamond, semiconductor, watchmaking, elec- tronic, automotive and medical industries.

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Case Studies - Synova SA

Edge Grinding Edge Trimming. Cutting of IGTB Power Chips: ... LMJ is used to cut difficult-to-machine metal alloys for electrical components reaching high edge quality and accuracy. Metal Alloys: ... Advanced Laser Systems. Synova is the pioneer of a …

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Laser Machining Of Advanced Materials

machines, and … Alabama Specialty Products, Inc. - alspi Jun 23, 2021 · All Synova laser cutting systems are based on the unique Laser MicroJet technology, performing highly accurate and fast machining without thermal damage, taper and depositions. LMJ production machines have a proven performance of 97% uptime (semiconductor industry).

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CUTTING l A MOND 00LS B A .SER MICROJET® - synova …

SYNOVA LCS 50-5 LASER CUTTING SYSTEM I'he Synova LCS 50-5 laser cutting system can cut extremely hard materials with high precision. It is a compact machine with 5-axis capability with a user-friendly interface and intuitive CARL software for batch processing of pans such as diamond tools. Synova (1) In the above example, the Synova LmJ (1 ...

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SYNOVA Announces Grand Opening of New U.S. Headquarters

SYNOVA S.A., a provider of advanced laser cutting systems, has announced the opening of its new 6,100 sq. ft., state-of-the-art facility in Totowa, NJ. The new U.S. technology center will support operations throughout North and South America with the latest Synova CNC machines incorporating its advanced waterjet laser cutting technology.

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Synova SA | LinkedIn

Synova is a leading provider of advanced laser cutting systems for a broad range of precision machining applications. Our aim is to provide leading-edge device manufacturers with superior ...

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Company Profile - Synova

Innovative Micro-Machining Systems Synova is the pioneer of a revolutionary water jet guided laser technology providing state-of-the- art cutting and dicing solutions as well as drilling and edge grinding systems for the semiconduc- tor, electronic, automotive, energy, aerospace, watchmaking, tool, diamond and medical indus- tries.

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Dicing Equipment | Electronics catalog

Dicing saw machine, wafer tape mounter, wafer expander, UV irradiation machine, wafer cleaning machine. Dicing and back grinding supplies: blades, chucks, UV films, spindles etc. View Catalog View Blog

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Synova Receives Multiple-System Orders From Korean OLED ...

The first order was placed for Synova's Laser Stenciling System, LSS 1200, for OLED mask manufacturing, and the second for the company's Laser Grinding System, LGS 200A, for thin-wafer edge grinding. Both orders mark Synova's penetration into the Korean market, and ultimately, the increased adoption of its Laser MicroJet® for leading-edge ...

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Synova: Your supplier of water jet guided laser cutting ...

First Laser Stencil (LSS) and Edge Grinding Systems (LGS) Relocation of international headquarters to Ecublens-Lausanne, Switzerland. 2001 : Introduction of Laser Dicing Systems (LDS) for electronics and semiconductor industry and Laser Cutting Systems (LCS) 1997 : Foundation of Synova S.A. Numerous awards for LMJ breakthrough invention. 1993

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Precision cutting and grooving with the Laser MicroJet

Synova SA, Switzerland Precision cutting and grooving with the Laser MicroJet ... EPMT 2010 3 Founded: 1997 Headcount: 60 employees Company. EPMT 2010 4 Products Laser Dicing System (LDS) Laser Grinding System (LGS) Hybrid Laser Saw (HLS) w/ Disco Corp. Cutting / grooving of wafers Laser Stencil System (LSS) ... SYSTEM Machine type LCS300 ...

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Laser Cutting System - IN DIAMOND

milling, slicing, edge grinding (K-land edges, single or multiple clearance angles), engraving, profiling The LCS 305 with integrated water jet guided laser technology (Laser MicroJet®) is specifically designed for the automatic production of large and small diamond cutting tools. The CNC machine with five synchronous axes is

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Synova receives multiple-system orders from Korean ...

The first order was placed for the company's Laser Stenciling System, LSS 1200, for OLED mask manufacturing, and the second for the company's Laser Grinding System, LGS 200A, for thin wafer edge grinding. Both orders …

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Laser Machining Of Advanced Materials

Examples include laser cutting machines, oxy-fuel cutting machines, plasma cutting machines, and water-jet cutting technology. These machines have ... grinding machine, milling machine, laser cutting machine, wire cutting, discharge processing machine and other advanced processing equipment.In addition, we have sufficient inspection equipment ...

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Complex CNC Machine Debris Removal Issue Solved

Complex CNC Machine Debris Removal Issue Solved. November 1, 2021. The build-up of metal chips and debris in CNC turning machines can cause damage, affect precision and shorten the life of the products. In addition, it can cause problems when attempting to dispose of the machine's coolant water waste. Effective removal of the metal debris has ...

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Synova Confidential Laser Microjet ... Laser Edge-Grinding System (LGS) with DIT Hybrid Laser Saw (HLS) with Disco ... (DCS) Laser Drilling System with Posalux Cutting of diamonds Machines with Manufacturing Partners Laser Cutting System (MCS) with Makino Tool Cutting / Turbine Drilling System (TCS / TDS 250) with Willemin-Macodel.

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Water jet guided laser cutting technology | Synova

Synova's new 300 mm (12") wafer dicing system integrates a maintenance free fiber laser. Details page LDGS 300 A The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers.

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Water jet guided Laser MicroJet for semiconductor ... - Synova

Synova's unique water jet guided laser systems offer many advantages for applications in the semiconductor industry compared to conventional diamond blade saws or laser systems. The "gentle" Laser MicroJet (LMJ) method enables the cutting, grooving and dicing of sensitive materials resulting in smooth edges, high wafer fracture strength ...